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[PDF] IPC-A-610D - Pacific Microelectronics Inc

hot solder dipped and gold plated (these are “H”, “K”, “C” and “B” termination, respectively, per ..... Vapor Phase), conductive adhesive or thermal compression ...... (4% Lead min). Melting Point of 200ºC ...... The FFB has been designed for printed circuit board mounting. Its performance allows ...... and ETC guns. Power laser.

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